Wafer-level optics (WLO) enables the design and manufacture of miniaturized optics at the wafer level using advanced semiconductor-like techniques. The end product is cost effective, miniaturized optics that enable the reduced form factor of camera modules for mobile devices.[1].
The technology is scalable from a single-element CIF/VGA lens to a multi-element mega pixel lens structure, where the lens wafers are precision aligned, bonded together and diced to form multi-element lens stacks. As of 2009 the technology was used in about 10 percent of the mobile phone camera lens market.[2]